JOURNAL OF ELECTRONIC PACKAGING期刊中文简介
电子包装杂志发表论文，使用实验和理论(分析和计算机辅助)的方法、方法和技术来解决和解决在电子和光子学组件、设备和系统的分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题。
JOURNAL OF ELECTRONIC PACKAGING期刊英文简介
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
JOURNAL OF ELECTRONIC PACKAGING期刊近年期刊自引率趋势图
JOURNAL OF ELECTRONIC PACKAGING期刊JCR分区
| JCR分区等级 | JCR所属学科 | 分区 | 影响因子 |
| Q3 | ENGINEERING, ELECTRICAL & ELECTRONIC | Q3 | 1.931 |
| ENGINEERING, MECHANICAL | Q3 |
JOURNAL OF ELECTRONIC PACKAGING近年期刊影响因子趋势图
JOURNAL OF ELECTRONIC PACKAGING期刊CiteScore数值
| CiteScore | SJR | SNIP | 学科类别 | 分区 | 排名 | 百分位 |
| 3.70 | 0.493 | 0.861 | 大类：Engineering 小类：Mechanics of Materials | Q2 | 145 / 384 |
62% |
| 大类：Engineering 小类：Electrical and Electronic Engineering | Q2 | 284 / 708 |
59% |
|||
| 大类：Engineering 小类：Computer Science Applications | Q2 | 307 / 747 |
58% |
|||
| 大类：Engineering 小类：Electronic, Optical and Magnetic Materials | Q2 | 122 / 259 |
53% |
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